Arizona State University (ASU), in partnership with Deca Technologies, has been awarded a $100 million federal grant to spearhead SHIELD USA, a cutting-edge initiative aimed at advancing domestic microchip packaging capabilities. The project seeks to position the United States as a global leader in microelectronics while bolstering national security.
“This is a critical step for U.S. semiconductor independence,” said ASU President Michael Crow in a statement. “We are eager to lead the work that will enable SHIELD USA to play a pivotal role in ensuring the country’s technological and economic future.”
Craig Bishop, Chief Technology Officer of Deca Technologies, emphasized the importance of innovation in the project. “This is a fantastic example of a university working in close partnership with industry to drive innovation,” Bishop said.
Funding and Strategic Impact
The grant is part of the CHIPS R&D National Advanced Packaging Manufacturing Program, administered by the U.S. Department of Commerce. The funding aligns with the objectives of the CHIPS and Science Act, which aims to enhance the U.S.’s competitiveness in semiconductor technology and reduce reliance on overseas manufacturing.
“Advance packaging is a key component of the microchip manufacturing process, yet most advanced packaging research and manufacturing occurs overseas,” said U.S. Senator Mark Kelly, who helped negotiate the CHIPS Act. “This investment builds upon other investments we’re seeing in Arizona to bring advanced packaging back to the United States.”
Arizona’s Role in Semiconductor Innovation
Arizona is increasingly recognized as a hub for semiconductor development. The grant follows significant recent investments in the state, including a $6.6 billion federal award to Taiwan Semiconductor Manufacturing Company (TSMC) for its Phoenix facilities.
SHIELD USA’s groundbreaking work will leverage ASU’s research expertise and Deca Technologies’ industry innovations to develop new packaging methods that could transform the semiconductor industry. These advancements are seen as critical in the U.S.’s competition with China for leadership in semiconductor technology.
Driving Economic and National Security Goals
The initiative not only addresses technological challenges but also reinforces the nation’s economic and security priorities. By reestablishing advanced packaging manufacturing capabilities domestically, the U.S. aims to secure its semiconductor supply chain and maintain its leadership in global innovation.
This collaboration between ASU and Deca Technologies underscores the vital role of public-private partnerships in shaping the future of American technology and industry.
